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CAVITY OPTICAL TRANSDUCER PLATFORM WITH INTEGRATED ACTUATION FOR MULTIPLE SENSING APPLICATIONS.

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We developed a compact, on-chip optomechanical transducer using micro-electro-mechanical-systems (MEMS) technology. This device achieves ultra-low displacement noise for advanced resonant and non-resonant sensors.

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Area of Science:

  • Optomechanics
  • Micro-electro-mechanical-systems (MEMS)
  • Nanotechnology

Background:

  • Micro-electro-mechanical-systems (MEMS) offer compact, robust, and potentially low-cost fabrication for sensors.
  • Optomechanical systems enable sensitive displacement measurements through light-matter interactions.
  • Integrating these technologies is key for next-generation sensing platforms.

Purpose of the Study:

  • To present a novel on-chip cavity optomechanical transducer platform.
  • To combine high measurement bandwidth with a very low displacement noise floor.
  • To leverage MEMS fabrication for compact and scalable sensor solutions.

Main Methods:

  • Utilized surface-micromachined silicon-on-insulator (SOI) photonic, silicon nitride structural, and metal electrical actuation layers.
  • Employed front- and backside bulk micromachining for v-grooves and overhanging cantilevers.
  • Integrated silicon micro-disk optical cavities for optical readout of mechanical motion.

Main Results:

  • Achieved a displacement noise floor below 10 fm/√Hz across a wide range of mechanical stiffnesses (0.2 N/m to 200 N/m).
  • Demonstrated electrical actuation (electrothermal/electrostatic) for device control and readout gain tuning.
  • Fabricated fiber-pigtailed transducers integrating multiple MEMS layers.

Conclusions:

  • The developed optomechanical transducer platform offers a unique combination of high performance and miniaturization.
  • This technology enables a wide array of high-performance on-chip resonant and non-resonant sensors.
  • The platform's scalability and low-cost fabrication potential pave the way for widespread adoption in sensing applications.