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Updated: May 7, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
Gangchen Ren1, Zhongtong Wang1, Xinzhu Huang2
1Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, New York 14853, USA. zt223@cornell.edu.
Researchers developed thermally conductive polyethylene (PE) bars using solid-state drawing. These advanced thermal interface materials significantly reduce hot spot temperatures in microelectronics, enhancing device performance.
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