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Three-Dimensional Nanopatterning Using Extreme Ultraviolet Colloidal Talbot Lithography.

Saurav Mohanty1, Ethan Flores1, Daniel Hur1

  • 1Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.

Nano Letters
|April 30, 2026
PubMed
Summary
This summary is machine-generated.

This study introduces extreme ultraviolet (EUV) colloidal Talbot lithography (CTL) to create 3D nanostructures. This novel method achieves 25 nm feature sizes in a single exposure, advancing nanolithography capabilities.

Keywords:
3D nanolithographyEUV lithographyTalbot effectcolloidal assembly

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Area of Science:

  • Nanotechnology
  • Lithography
  • Materials Science

Background:

  • Current extreme ultraviolet (EUV) lithography is restricted to 2D structures.
  • Scaling challenges persist for high-resolution 3D nanostructure fabrication.

Purpose of the Study:

  • To demonstrate EUV colloidal Talbot lithography (CTL) for 3D nanostructure patterning.
  • To achieve 25 nm minimum feature sizes in 3D using a single exposure.

Main Methods:

  • Utilized a self-assembled nanosphere monolayer as a binary mask.
  • Employed a tabletop high-harmonic generation (HHG) EUV source for volumetric patterning.
  • Conducted finite difference time domain (FDTD) simulations to analyze interference patterns.

Main Results:

  • Successfully fabricated 2D nanostructures with tunable unit-cell geometry.
  • Achieved 3D nanostructures with feature sizes as small as 25 nm.
  • Demonstrated single-exposure 3D EUV lithography with high fringe contrast.

Conclusions:

  • EUV CTL is a cost-effective method for single-exposure 3D nanolithography.
  • The technique requires minimal hardware, making it broadly accessible.
  • Applications include nanophotonics, quantum devices, and advanced materials.