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Related Experiment Video

Updated: May 31, 2025

Micro-masonry for 3D Additive Micromanufacturing
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Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by

Niklas Piechulek1, Lei Xu1, Jan Fröhlich1

  • 1Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, Germany.

Micromachines
|January 25, 2025
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Summary

This study explores high-temperature Three-dimensional Mechatronic Integrated Devices (3D-MIDs) using stereolithography 3D-printing. Results show thermoset plastics enable reliable circuit miniaturization on resin substrates, expanding 3D-MID applications.

Keywords:
MIDSLAlaser direct structuringmechatronic integrated devicesminiaturization

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Additive Manufacturing

Background:

  • Three-dimensional Mechatronic Integrated Devices (3D-MIDs) offer component miniaturization and enhanced functionality but face limitations in high-temperature applications due to material challenges.
  • While ceramic substrates show thermal stability, their reliability under high mechanical stress is a concern.
  • Existing 3D-MID technologies struggle with high-temperature environments and complex mechanical loads.

Purpose of the Study:

  • To investigate the feasibility of fabricating 3D-MID components using stereolithography (SLA) 3D-printing on high-temperature-resistant resin substrates.
  • To explore circuit miniaturization techniques on these novel substrates.
  • To analyze the impact of laser parameters on electrical resistance using Response Surface Methodology (RSM).

Main Methods:

  • Fabrication of 3D-MID components using SLA 3D-printing with high-temperature-resistant resin substrates.
  • Incorporation of Laser Direct Structuring (LDS) additives into the resin for circuit formation.
  • Laser structuring and metallization processes to create conductive pathways.
  • Analysis of laser parameters' influence on resistance values via RSM.
  • Integration of through-holes (vias) and small package chips (BGA, QFN) for enhanced connectivity.

Main Results:

  • SLA 3D-printing successfully produced substrates with low surface roughness, facilitating precise feature formation.
  • Electric circuits were reliably formed on resin substrates with LDS additives, achieving a minimum conductor spacing of 150 µm.
  • Integration of vias and smaller package chips enabled further circuit miniaturization and robust soldered connections.
  • Thermoset plastics were validated as viable substrates for 3D-MID components in high-temperature conditions.

Conclusions:

  • Stereolithography 3D-printing offers a viable method for creating high-temperature-resistant resin substrates for 3D-MIDs.
  • Circuit miniaturization is achievable on SLA-printed substrates, expanding the application scope of 3D-MID technology.
  • This research provides a framework for developing advanced 3D-MIDs suitable for demanding thermal and mechanical environments.