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Bridging the Bio-Electronic Interface with Biofabrication
Published on: June 6, 2012
He Sun1, Xiaoting Xue2, Gabriella L Robilotto3,4
1Department of Biomedical Engineering and the Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.
A new liquid-based encapsulation protects implantable bioelectronics in extreme pH environments. This flexible, transparent material ensures device function and biocompatibility for advanced medical research and clinical applications.
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