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Sub-GHz optical pulsing using a thermally generated heterostructure with strong optomechanical coupling.
Optics Express
|January 29, 2025
Summary
Thermal engineering enables phonon lasing in silicon optical cavities by creating dynamic heterostructures. This breakthrough overcomes challenges for phonon lasing, paving the way for integrated optical frequency combs.
Area of Science:
- Photonics
- Optomechanics
- Thermal Engineering
Background:
- Phonon lasing requires specific conditions like unity cooperativity and sideband-resolved operation.
- Silicon optical cavities are promising for optomechanical applications.
- Achieving phonon lasing in weakly confined cavities is challenging.
Purpose of the Study:
- To demonstrate phonon lasing and optical pulsing in a silicon optical cavity using thermal engineering.
- To overcome the limitations of achieving phonon lasing in edge defect photonic crystal cavities.
- To explore the use of dynamically formed heterostructures for optomechanical applications.
Main Methods:
- Shaping the steady-state heat profile generated by absorption in a silicon optical cavity.
- Creating a dynamic heterostructure by modifying the cavity's refractive index using generated heat.
- Utilizing an edge defect photonic crystal optomechanical cavity to couple the compressed optical mode to a thermo-optical/free-carrier-dispersion limit cycle.
Main Results:
- Achieved phonon lasing and sub-GHz optical pulsing (30 MHz) with a photon-phonon cooperativity of 0.088.
- The thermal heterostructure compressed the optical mode volume, relaxing constraints on cavity parameters.
- Successfully initiated phonon lasing by dynamically forming a heterostructure, overcoming insufficient mode confinement.
Conclusions:
- Thermal engineering is a novel approach to initiate phonon lasing in silicon optical cavities.
- The developed method dynamically forms a heterostructure, enabling optomechanical resonance and phonon lasing.
- Further advancements could lead to fully integrated, sub-GHz optical frequency combs.

