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Updated: May 30, 2025

$Femtosecond Laser Filaments for Use in Sub-Diffraction-Limited Imaging and Remote Sensing$

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Deep-Ultraviolet AlN Metalens with Imaging and Ultrafast Laser Microfabrication Applications.

Yu Chieh Peng¹, Yu Jie Wang¹, Kuan-Heng Chen¹

¹Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan.

|January 29, 2025

Summary

Aluminum nitride (AlN) metalenses offer a cost-effective solution for deep-ultraviolet (DUV) applications. These compact DUV metalenses enable high-resolution imaging and direct laser writing, advancing photonic technologies.

Keywords:

DUV imaging deep ultraviolet light laser direct writing metalens metasurface

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Area of Science:

Optics and Photonics
Materials Science
Nanotechnology

Background:

Deep-ultraviolet (DUV) light is crucial for advanced applications like fabrication, molecular research, and biomedical imaging.
Compact metalenses are needed to enhance innovation in these fields, requiring cost-effective, durable, and scalable material platforms.

Purpose of the Study:

To present aluminum nitride (AlN) metalenses as an efficient solution for DUV applications.
To demonstrate the capabilities of AlN metalenses for DUV focusing, imaging, and laser direct writing.

Main Methods:

Fabrication of ultra-thin (380 nm) AlN metalenses.
Characterization of DUV focusing and imaging performance.
Demonstration of DUV ultrafast laser direct writing of microstructures.

Main Results:

AlN metalenses achieve DUV focusing and imaging near the theoretical diffraction limit.
The metalenses exhibit robustness to intense ultrafast laser irradiation.
Successful direct writing of microstructures using DUV ultrafast laser was demonstrated on polymer and silicon substrates.

Conclusions:

Aluminum nitride metalenses provide an efficient and robust platform for DUV photonic applications.
These metalenses hold significant promise for advancing technologies in the critical DUV wavelength regime.
The demonstrated capabilities pave the way for new innovations in DUV-based fabrication and imaging.