Anisotropic Heat Conduction of Silicon Nanocube through Strain Gradient Engineering

Jun Lyu1, Shuo Qiao1, Lin Yang1,2

  • 1Department of Advanced Manufacturing and Robotics, College of Engineering, Peking University, Beijing 100871, China.

Nano Letters
|February 5, 2025
PubMed
Summary

Researchers developed a new method for controlling heat flow using strain gradients in silicon nanocubes. This technique offers a reversible and robust way to achieve directional thermal regulation for applications like microchip cooling.

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