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Highly Stable Electronics Based on β-Ga2O3 for Advanced Memory Applications
Xiaoxi Li1,2, Yu-Chun Li3, Yingguo Yang3,4,5
1Hangzhou Institute of Technology, Xidian University, Hangzhou, 311200, China.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|February 6, 2025
Summary
Researchers developed a novel hexagonal boron nitride (h-BN)/β-Ga₂O₃ heterostructure junction field-effect transistor (HJFET) for harsh environments. This device shows excellent thermal stability and memory applications, advancing wide-bandgap semiconductor technology.
Area of Science:
- Materials Science and Engineering
- Semiconductor Physics
- Device Fabrication
Background:
- Wide-bandgap (WBG) semiconductors are crucial for advancing electronic technology and enabling new device functionalities.
- While β-Ga₂O₃ shows promise, its application in high-temperature, high-speed volatile memory for harsh environments remains underexplored.
Purpose of the Study:
- To fabricate and characterize a high-performance hexagonal boron nitride (h-BN)/β-Ga₂O₃ heterostructure junction field-effect transistor (HJFET).
- To evaluate the thermal reliability and environmental stability of the fabricated HJFET for harsh environment applications.
- To demonstrate the potential of the HJFET in accelerator-in-memory computing, including dynamic random-access memory and neural network computations.
Main Methods:
- Fabrication of a h-BN/β-Ga₂O₃ heterostructure junction field-effect transistor (HJFET).
- Electrical characterization of the HJFET, including off-state current, on/off current ratio, contact resistance, and field-effect electron mobility.
- Testing of thermal reliability across an ultra-wide temperature range (223–573 K) and assessment of long-term environmental stability in air.
- Demonstration of application in accelerator-in-memory computing architectures.
Main Results:
- The HJFET achieved an ultra-low off-state current (≈10 fA) and a high on/off current ratio (≈10⁸).
- Excellent device performance was observed, including low contact resistance (5.6 Ω·mm) and high field-effect electron mobility (156 cm²(Vs)⁻¹).
- The device exhibited outstanding thermal reliability from 223 K to 573 K and long-term stability in air, confirming its suitability for harsh environments.
- Successful implementation in dynamic random-access memory structures and neural network computations was demonstrated.
Conclusions:
- The fabricated h-BN/β-Ga₂O₃ HJFET demonstrates superior performance and reliability for operation in extreme environments.
- This β-Ga₂O₃-based device holds significant promise for applications in demanding sectors like automotive, aerospace, and sensor technology.
- The findings open new possibilities for advanced electronic devices operating under harsh conditions, contributing to the continued advancement of semiconductor technology.
Keywords:
dynamic random‐access memorystabilitywide‐bandgap semiconductorsβ‐Ga2O3/h‐BN heterostructure
