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Big-MEMS for high thermal conductivity measurement
Haiyu He1,2, Yuxi Wang1,2, Bai Song1,2,3
1Department of Energy and Resources Engineering, Peking University, Beijing 100871, China.
The Review of Scientific Instruments
|February 6, 2025
Summary
We developed a novel big-MEMS method using silicon nitride devices for precise thermal conductivity measurements of high-conductivity materials. This technique overcomes challenges like contact resistance, enabling accurate characterization.
Area of Science:
- Materials Science
- Solid State Physics
- Nanotechnology
Background:
- High thermal conductivity materials are vital for thermal management.
- Accurate thermal measurement is challenging due to contact resistance and small temperature differences.
Purpose of the Study:
- To address challenges in measuring high thermal conductivity materials.
- To present a novel big-MEMS approach for thermal measurement.
Main Methods:
- Utilized suspended silicon nitride (SiNx) nanofilms with integrated platinum resistive heater/thermometers.
- Employed a multiprobe experimental scheme with ultralow thermal conductance SiNx suspension beams.
- Minimized contact thermal resistance impact to less than 3%.
Main Results:
- Successfully measured thermal conductivity of metal wires (platinum, gold, silver) and silicon bars (doped, intrinsic).
- Achieved thermal conductivity values exceeding 1000 W m⁻¹ K⁻¹ at low temperatures.
- Obtained results show excellent agreement with established data.
Conclusions:
- The multiprobe big-MEMS approach using SiNx devices provides a reliable method for high thermal conductivity material characterization.
- This technique facilitates the identification and understanding of materials with superior thermal transport properties.
