Unseen threats: Lumens 2.0 study reveals the hidden challenges of cleaning lumened surgical instruments

Cori L Ofstead1, Abigail G Smart1, Jill E Holdsworth2

  • 1Ofstead & Associates, Inc., Bloomington, MN.

PubMed
Abstract

Insights

Surgical instrument cleaning failed to remove debris, increasing infection risk. Even after repeated cleaning, visible soil and foreign materials remained, highlighting a critical need for improved sterilization methods.

Area of Science:

  • Medical device reprocessing
  • Infection prevention
  • Sterile processing

Background:

  • Surgical site infections (SSIs) contribute to patient morbidity and prolonged antimicrobial therapy.
  • Contaminated surgical instruments, particularly those with retained tissue or debris, compromise sterilization efficacy.
  • Blood or soil on instruments can significantly hinder effective sterilization.

Purpose of the Study:

  • To determine the prevalence of visible soil or debris within surgical instruments.
  • To evaluate the effectiveness of recleaning efforts on removing internal debris.

Main Methods:

  • Borescopes were utilized to inspect the lumens of surgical instruments from orthopedic, neurologic, and ENT procedures.
  • Instruments with visible soil underwent up to three recleaning cycles followed by reinspection.
  • The impact of additional cleaning on debris removal was assessed.

Main Results:

  • 100% of inspected instruments (n=40) showed internal debris, discoloration, or residues.
  • 95% of instruments exhibited rusty patches within their lumens.
  • Recleaning removed some soil, but visible debris persisted in most lumens; lint and brush fragments were also noted.

Conclusions:

  • Current cleaning methods, following manufacturer instructions, are ineffective for lumened surgical instruments.
  • Improving surgical instrument reprocessing requires collaboration among infection prevention, sterile processing departments, and manufacturers.
  • Developing new strategies is essential to enhance the outcomes of surgical instrument processing and reduce SSIs.