Ultra-Thick Graphene Films with High Thermal Conductivity Through a Non-Stacking Strategy.

Area of Science:

• Materials Science
• Nanotechnology
• Thermal Engineering

Background:

• Miniaturization of electronic devices increases heat flux density, demanding advanced thermal management materials.
• Graphene films (GFs) offer high thermal conductivity (K), but achieving sufficient thickness (d) for effective heat dissipation remains a challenge.
• Existing fabrication methods struggle to balance high K and large d in GFs due to interfacial defects and material limitations.

Purpose of the Study:

• To develop a novel non-stacking strategy for fabricating monolithic thick graphene films.
• To overcome limitations in achieving both high thermal conductivity and significant thickness in graphene films.
• To enhance the heat transfer capability of graphene films for improved thermal management in electronic systems.

Main Methods:

• Utilized ultra-small-sized graphene oxide slurry.
• Introduced multi-line shearing technique.
• Employed a specially designed frame for fabricating stable, highly oriented thick films.

Main Results:

• Successfully produced monolithic thick graphene films (GFs) with ultra-high thermal conductivity (K) exceeding 1600 W m⁻¹ K⁻¹ at thicknesses over 300 µm.
• Achieved a 17.03% improvement in K and a 21.34% increase in the K × d value (0.544 W K⁻¹), indicating enhanced heat transfer capability.
• Demonstrated a 3.3 °C reduction in chip operating temperature, validating the effectiveness for electronic heat dissipation.

Conclusions:

• The proposed non-stacking strategy enables the fabrication of high-performance thick graphene films, overcoming interfacial defects.
• This method offers a promising solution for producing monolithic GFs with superior thermal conductivity and thickness.
• Represents an effective route for advanced heat dissipation in increasingly miniaturized electronic systems.