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Directly Printed 3D Soft Microwave Plasmonic Enhanced-Q Resonators by Decoupling from Lossy Media
Hoon Yeub Jeong1, Jonghyun Jeong1, Jun-Chan Choi1
1School of Electrical Engineering, Korea University, Seoul, 02841, Republic of Korea.
Advanced Materials (Deerfield Beach, Fla.)
|February 24, 2025
Summary
Researchers developed 3D printed soft plasmonic resonators using conductive composites. These novel electromagnetic devices offer enhanced quality factors and enable advanced wireless sensing applications in soft electronics.
Area of Science:
- Soft electronics
- Electromagnetics
- Materials science
Background:
- Current soft electronic designs are limited to 2D/2.5D, hindering 3D structural integrity.
- Dielectric losses in elastomeric substrates limit performance of electromagnetic devices like resonators.
Purpose of the Study:
- To propose directly printed 3D electromagnetic soft plasmonic enhanced-quality (Q) factor resonators.
- To overcome limitations of 2D/2.5D designs and substrate-induced dielectric losses.
Main Methods:
- Incorporation of an immiscible solvent into an elastomer matrix to form emulsion phases.
- Fabrication of 3D-printed structures using highly conductive composites.
- Integration of a coplanar ground plane to decouple resonators from substrates.
Main Results:
- Demonstrated 3D microwave plasmonic resonators with high design freedom (e.g., pillars, hooks).
- Achieved a 3.4-fold enhancement in Q-factor (octupole mode) compared to 2D resonators by leveraging resonance in air.
- Enabled stable resonator operation on high-permittivity surfaces like human skin.
- Showcased wireless deformation-sensing capabilities for simultaneous strain amplitude and orientation detection.
Conclusions:
- Directly printed 3D soft plasmonic resonators offer superior performance and design flexibility.
- The developed resonators overcome substrate loss issues, enabling new applications in soft electronics.
- This technology paves the way for advanced sensing applications, including wireless deformation monitoring.

