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Published on: November 11, 2022
Debondable phenoxy-based structural adhesives with β-amino amide containing reversible crosslinkers
Francesca Portone1, Loc Tan Nguyen2, Roberta Pinalli1
1Dipartimento di Scienze Chimiche, della Vita e della Sostenibilità Ambientale, Università degli Studi di Parma Parco Area delle Scienze 17/A 43124 Parma Italy enrico.dalcanale@unipr.it.
Researchers developed sustainable, recyclable phenoxy-based adhesives using dynamic chemistry. These advanced materials offer durability and controlled debonding, ideal for high-performance applications.
Area of Science:
- Polymer Chemistry
- Materials Science
- Adhesive Technology
Background:
- Conventional adhesives often lack durability, reprocessability, and sustainability.
- Dynamic covalent chemistry offers pathways to create responsive and recyclable materials.
- Phenoxy-based polymers are versatile platforms for advanced material development.
Purpose of the Study:
- To introduce novel dynamic phenoxy-based adhesives utilizing β-aminoamide exchange chemistry.
- To engineer adhesives with enhanced durability, reprocessability, and sustainability.
- To optimize adhesive properties such as adhesion, flexibility, and thermal stability.
Main Methods:
- Two-step synthesis process to create linear poly-aminoamides.
- Tailoring amine formulations to control adhesive characteristics.
- Characterization of thermal stability, viscoelastic properties, and recycling performance.
Main Results:
- Adhesives demonstrated effective crosslinking and high thermal stability (Td5% ~340-350 °C).
- Materials exhibited temperature-responsive viscoelastic behavior and exceptional creep resistance.
- Formulation E-BAAT5 (5 mol% TETA) retained 98% lap shear strength after recycling, with controlled debonding at elevated temperatures.
Conclusions:
- The developed phenoxy-based adhesives offer a promising solution for high-performance, sustainable bonding.
- The dynamic β-aminoamide chemistry enables efficient recycling and controlled debonding.
- These materials are suitable for demanding applications requiring durability and reprocessability.
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