Fabrication of Microelectrodes on Microchip Sidewalls for Injectable Biomedical Devices

Implantable Medical Devices (IMDs) leveraging advanced CMOS technology promise to revolutionize neural network modulation and brain activity monitoring through miniaturized, battery-free designs. Conventional miniaturization efforts face challenges due to the reliance on off-chip components and complex assembly that increase the implant's volume and reduce reliability. Our research introduces a novel integration technique by fabricating microelectrodes on the sidewalls of encapsulated CMOS chips, significantly reducing the size of the implant. Central to our approach is the employment of a plasma-focused ion beam (PFIB), enabling precise and efficient electrode fabrication.