Realizing Intrinsically Ultralow and Glass-Like Thermal Transport via Chemical Bonding Engineering.

Zhonghao Xia1, Xingchen Shen2,3, Jun Zhou4

  • 1Key Laboratory of Advanced Materials and Devices for Post-Moore Chips, Ministry of Education, School of Mathematics and Physics, University of Science and Technology Beijing, Beijing, 100083, China.

Summary

Researchers engineered new materials with ultralow lattice thermal conductivity using weak chemical bonds. These novel compounds show potential for advanced thermal management and energy applications.

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