Molecular Chain Interpenetration-Enabled High Interfacial Compatibility of Ionic and Electronic Conductors for...

Area of Science:

• Materials Science
• Polymer Chemistry
• Nanotechnology

Background:

• Ionic devices utilize hybrid circuits of mobile ions and electrons for applications like flexible electronics and biomedicine.
• Poor interfacial compatibility between hard electronic conductors and soft ionic conductors limits deformability, sensitivity, electromechanical responses, and stability in ionic devices.

Purpose of the Study:

• To fabricate an interpenetrating interface between electronic and ionic conductors to overcome limitations in current ionic devices.
• To enhance the bonding strength, contact area, flexibility, stability, and overall device performance of ionic devices.

Main Methods:

• Fabrication of an interpenetrating interface using in situ polymerization of silicone-modified polyurethane/carbon nanotube electronic conductors and ionoelastomers.
• Characterization of the interface through analysis of molecular chain entanglement and molecular forces (ion-dipole interactions, H-bonds).

Main Results:

• A robust interpenetrating electronic/ionic conductor interface was achieved, significantly enhancing bonding strength and contact area.
• The developed electroadhesive demonstrated super robust shear strength (317 kPa) at a low voltage (-4 V).
• Ionic diodes and transistors maintained semiconductor characteristics (rectification, switching) under arbitrary deformation, and electromechanical transducers showed sensitive responses to deformation signals.

Conclusions:

• The developed interpenetrating interface strategy effectively solves interfacial compatibility issues between electronic and ionic conductors.
• This approach leads to ionic devices with excellent flexibility, stability, and superior performance.
• The findings hold significant promise for advancing the development of multifunctional ionic devices for diverse applications.