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Inductively Coupled Plasma Atomic Emission Spectroscopy: Instrumentation01:26

Inductively Coupled Plasma Atomic Emission Spectroscopy: Instrumentation

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Inductively coupled plasma (ICP) is the common plasma source used in atomic emission spectroscopy (AES), a technique that detects and analyzes various elements in a sample. This method is often called inductively coupled plasma atomic emission spectroscopy (ICP-AES).
There are three main types of inductively coupled plasma atomic emission spectroscopy  (ICP-AES) instruments: sequential, simultaneous multichannel, and Fourier transform instruments, with the latter being less commonly used....
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Atomic Emission Spectroscopy: Overview01:20

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Atomic emission spectroscopy (AES) is an analytical technique used to determine the elemental composition of a sample by analyzing the light emitted from excited atoms. In AES, atoms in a sample are excited to higher energy levels by thermal energy from high-temperature sources, such as plasma, arcs, or sparks. When these excited atoms return to lower energy states, they emit light at specific wavelengths characteristic of each element. The resulting atomic emission spectrum, which consists of...
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Inductively Coupled Plasma Atomic Emission Spectroscopy: Principle01:19

Inductively Coupled Plasma Atomic Emission Spectroscopy: Principle

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Inductively coupled plasma (ICP) is the most widely used plasma source in atomic emission spectroscopy (AES), also known as Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES). The ICP source, or torch, consists of three concentric quartz tubes with argon gas flowing through them. A spark from a Tesla coil initiates the ionization of argon, generating a high-temperature plasma.
The ions and electrons produced interact with the fluctuating magnetic field created by a water-cooled...
435
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  1. Home
  3. Ultrafast Binder-free Corona Discharge-enabled Automated Electrostatic Patterning (aep) Technique.
  1. Home
  3. Ultrafast Binder-free Corona Discharge-enabled Automated Electrostatic Patterning (aep) Technique.

Related Experiment Video

High-resolution Patterning Using Two Modes of Electrohydrodynamic Jet: Drop on Demand and Near-field Electrospinning
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Ultrafast Binder-Free Corona Discharge-Enabled Automated Electrostatic Patterning (AEP) Technique.

Zijian Weng1, Marcelo Farfan1, Evan Williams1

  • 1Department of Mechanical Engineering, University of South Florida, 4202 E. Fowler Ave, Tampa, Florida 33620, United States.

ACS Applied Materials & Interfaces
|April 1, 2025

View abstract on PubMed

Summary
This summary is machine-generated.

This study introduces an ultrafast, binder-free automated electrostatic patterning (AEP) method for printed electronics. AEP achieves sub-100 μm resolution in 2 seconds, significantly enhancing manufacturing efficiency.

Keywords:
Electrostaticautopatterningbinder-freeprinted electronicsprinting

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Printed electronics rely on patterning techniques for diverse applications.
  • Current methods often involve time-consuming processes like binder use, ink formulation, and nozzle cleaning.

Purpose of the Study:

  • To introduce and investigate an ultrafast, binder-free patterning method for printed electronics.
  • To demonstrate the capabilities of automated electrostatic patterning (AEP) for high-resolution and rapid fabrication.

Main Methods:

  • Developed and analyzed corona discharge-enabled automated electrostatic patterning (AEP).
  • Utilized theoretical derivations, COMSOL simulations, and high-speed camera observations to understand AEP mechanisms.
  • Demonstrated AEP for manufacturing high-quality flexible electronics.

Main Results:

  • Achieved sub-100 μm resolution patterns in just 2 seconds.
  • Verified the autopatterning and binder-free nature of the AEP technique.
  • Showcased the fabrication of high-quality flexible electronic devices.

Conclusions:

  • AEP offers a significant advancement in printed electronics manufacturing efficiency.
  • The binder-free and ultrafast nature of AEP eliminates ink drying and mask abrasion issues.
  • AEP provides a sensitive and rapid patterning solution for next-generation electronics.