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Solvent-annealing-induced microphase separation in polyether polyurethane: a small-angle X-ray scattering study
Shanshan Wang1, Jiayao Song1, Keping Chen2
1State Key Laboratory of Environment-Friendly Energy Materials, School of Materials and Chemistry Southwest University of Science and Technology Mianyang621010 People's Republic of China.
Summary
Solvent vapor annealing refines polyurethane (PU) microstructure at lower temperatures. Methyl ethyl ketone (MEK) vapor showed the greatest effect, enhancing phase separation and thermal stability in PU materials.
Area of Science:
- Polymer Science
- Materials Science
- Surface Chemistry
Background:
- Polyurethane (PU) microphase separation is crucial for material properties.
- Thermal annealing can refine PU microstructure but requires high temperatures.
- Solvent vapor annealing presents a lower-temperature alternative for PU modification.
Purpose of the Study:
- To investigate the effects of solvent vapor annealing on polyurethane microphase separation.
- To compare the influence of different solvent vapors (MEK, acetone, toluene) on PU microstructure.
- To evaluate the thermal stability of solvent-annealed PU compared to conventionally annealed samples.
Main Methods:
- Small-angle X-ray scattering (SAXS) to analyze microphase separation structure.
- In situ variable-temperature SAXS to assess thermal stability.
- Analysis using a polydisperse hard-sphere model.
Main Results:
- Solvent annealing increased the degree of phase separation in PU.
- The effectiveness of solvents followed the order: MEK > acetone > toluene.
- Solvent-annealed PU exhibited enhanced thermal stability compared to quenched samples.
- Solvent annealing induced higher phase separation without significant domain growth.
Conclusions:
- Solvent vapor annealing is an effective method for refining PU microstructure at lower temperatures.
- MEK is a particularly effective solvent for enhancing PU phase separation and thermal stability.
- These findings offer a pathway for optimizing PU processing for advanced applications sensitive to heat.

