One-Step Fabrication of Packaged Glass Microheater Using Selective Laser Welding.
Dae-Seob Song1,2, Geun-Young Kim3, Jung-Woo Park1
1Department of Mechanical Engineering, Seoul National University, Seoul 08826, Republic of Korea.
ACS Applied Materials & Interfaces
|April 9, 2025
Summary
This study presents a novel selective laser welding technique using silver thin films for simultaneous micropatterning and packaging of microdevices. This method enables the creation of integrated, reusable microelectronic devices with enhanced functionality.
Area of Science:
- Materials Science
- Microfabrication
- Nanotechnology
Background:
- Microdevice fabrication often neglects integrated packaging, leading to complex assembly processes.
- Existing micropatterning techniques require separate packaging steps, increasing cost and complexity.
Purpose of the Study:
- To develop a single-step process for simultaneous micropatterning and packaging of microdevices.
- To introduce a selective laser welding method utilizing silver thin films for enhanced microdevice fabrication.
Main Methods:
- A novel selective laser welding process using a silver (Ag) thin film as a laser absorber and functional layer.
- Mathematical modeling and heat transfer simulations to optimize Ag thin film thickness and laser energy transfer.
- Fabrication of a Joule heating microheater and its integration using selective laser welding between glass substrates.
Main Results:
- The silver thin film acts as a laser absorber, enabling selective welding and creating insulating regions while preserving conductive electrodes in unwelded areas.
- Successful fabrication and hermetic packaging of a microheater device between glass substrates.
- Demonstration of a reusable cell culture tester with consistent heating performance after multiple uses, confirming device feasibility.
Conclusions:
- The proposed selective laser welding process offers a streamlined approach for manufacturing packaged microdevices.
- This technique integrates micropatterning and packaging, paving the way for advanced microelectronic device development.
- The developed method shows significant potential for diverse applications requiring miniaturized and robust microdevices.


