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Published on: April 30, 2018
High spatial resolution infrared measurement method for transient temperature field based on 3D-SwinIR
Zihao Huang1, Yirui Shen2, Mingxuan Zhou2
1Beijing Key Laboratory of Lightweight Multi-Functional Composite Materials and Structures, Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China.
Researchers enhanced material dynamic failure analysis by improving temperature field measurement resolution. A new 3D-SwinIR super-resolution method significantly boosts spatial resolution and reduces measurement errors in high-speed infrared imaging.
Area of Science:
- Materials Science
- Mechanical Engineering
- Geophysics
Background:
- Dynamic material failure is critical in mechanics and earthquake studies.
- Accurate, high-resolution temperature measurements during dynamic failure are challenging.
- Adiabatic shear bands' thermal fields require precise monitoring.
Purpose of the Study:
- To enhance spatial resolution for transient temperature field measurements during dynamic material failure.
- To develop and validate a novel multi-frame super-resolution method for high-speed infrared imaging.
- To improve the accuracy of temperature field measurements in dynamic events.
Main Methods:
- Developed a high-speed infrared detector system.
- Implemented a novel multi-frame super-resolution method (3D-SwinIR) utilizing 3D convolutional blocks and Swin Transformer.
- Evaluated the method using single structure and hat-shaped specimen experiments.
Main Results:
- Achieved high-quality super-resolution of high-speed infrared images.
- Increased spatial resolution by 37% in a single structure measurement.
- Reduced measurement errors for peak temperature (51%) and width (33%) in dynamic loading tests.
Conclusions:
- The 3D-SwinIR method significantly improves spatial resolution for transient temperature field measurements.
- This technique offers a high-resolution measurement approach for studying material dynamic thermal responses.
- The findings advance the understanding of dynamic failure mechanisms through precise thermal analysis.
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