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Published on: April 10, 2017
Metal Surface Treatments for Enhanced Heat Transfer in Metal-Composite Hybrid Structures
Dong Hyun Kim1, Wonhwa Lee1, Jung Bin Park1
1Department of Advanced Materials Engineering for Information and Electronics, Integrated Education Institute for Frontier Science and Technology (BK21 Four), Kyung Hee University, Yongin-si 17104, Republic of Korea.
Abstract:
Recently, there has been an increasing emphasis on improving the performance of metal components across various industries, such as automotive, aerospace, electronics, medical devices, and military applications. However, the challenges related to efficient heat generation and transfer in equipment and devices are becoming increasingly critical. A solution to these issues involves the adoption of a metal-composite hybrid structure, designed to efficiently manage heat, while substituting conventional metal components with polymer-carbon composites. In this study, nanopores were formed on the metal surface using an anodization process, serving as the basis for creating 3D-printed polymer/metal hybrid constructions. Various surface treatments, including plasma treatment, mixed electrolyte anodization, and etching, were applied to the metal surface to enhance the bonding strength between the 3D-printed polymer and the aluminum alloy. These processes were essential for developing lightweight polymer/metal hybrid structures utilizing a range of 3D-printed polymer filaments, such as polylactic acid, thermoplastic polyurethane, acrylonitrile butadiene styrene, polypropylene, thermoplastic polyester elastomer, and composite materials composed of polymer and carbon. In particular, the hybrid structures employing polymer-carbon composite materials demonstrated excellent heat dissipation characteristics, attributed to the remarkable conductive properties of carbon fibers. These technologies have the potential to effectively address the device heat problem by facilitating the development of lightweight hybrid structures applicable across various fields, including automotive, mobile electronics, medical devices, and military applications.

