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Dispersion forces and plastic deformation in tablet bond.

E N Hiestand

    Journal of Pharmaceutical Sciences
    |July 1, 1985
    PubMed
    Summary

    This study presents a new model for tablet bond formation, explaining how dispersion forces and plastic deformation influence tablet strength. The model helps estimate tablet bonding indices, crucial for pharmaceutical manufacturing.

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    Area of Science:

    • Materials Science
    • Pharmaceutical Engineering
    • Physical Chemistry

    Background:

    • Tablet bond formation is critical in pharmaceutical manufacturing.
    • Understanding the forces governing tablet strength is essential for product quality.
    • Existing models may not fully capture the complex deformation processes during compression and decompression.

    Purpose of the Study:

    • To develop a quantitative model for tablet bond formation.
    • To investigate the role of dispersion forces and plastic deformation in tablet strength.
    • To estimate the bonding index based on material properties and compression parameters.

    Main Methods:

    • Developed a model based on dispersion forces and spherical curvature of surfaces.
    • Utilized Hertz's equation for elastic deformation during decompression.
    • Calculated the number of contact points and area per contact point based on particle size, hardness, and solid fraction.
    • Estimated the bonding index using the derived equation.

    Main Results:

    • The model successfully estimated bonding indices within the lower range of experimental values.
    • The model highlights the dependence of surface curvature radius on plastic deformation during compression.
    • The study suggests plastic deformation during decompression significantly contributes to higher bonding indices.

    Conclusions:

    • The developed model provides a framework for understanding tablet bond formation.
    • Dispersion forces play a key role, but plastic deformation during decompression is crucial for high tablet strength.
    • Non-dispersion forces may contribute but are unlikely to be the primary factor for materials with high bonding indices.

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