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Flexible solid-liquid nanocomposite with high surface resistivity for effective electromagnetic interference
Yue Sun1, Tinglei Dong1, Ziyuan Chai1
1Key Laboratory of Bio-Inspired Smart Interfacial Science and Technology of Ministry of Education, School of Chemistry, Beihang University, 100191 Beijing, P. R. China. henglp@buaa.edu.cn.
Materials Horizons
|May 12, 2025
Summary
A novel nanocomposite offers electrical insulation, electromagnetic interference (EMI) shielding, and heat dissipation for electronics. This material integrates boron nitride and MXene with liquid metal in a PBO nanofiber matrix, overcoming design conflicts.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Miniaturizing electronics increases power density, leading to challenges like short circuits, electromagnetic interference (EMI), and heat buildup.
- Electrically insulative materials with integrated EMI shielding and heat dissipation are crucial for advanced electronics.
- A key challenge is balancing electrical insulation with continuous pathways for EMI shielding and thermal conductivity.
Purpose of the Study:
- To develop a novel nanocomposite material that provides electrical insulation, EMI shielding, and heat dissipation.
- To overcome the inherent conflict between electrical insulation and the need for conductive pathways for EMI shielding and thermal management.
- To create a robust material suitable for demanding applications in electronics, aerospace, and defense.
Main Methods:
- Sequential integration of boron nitride nanosheet-bridging-liquid metal (BLM) and MXene-bridging-liquid metal (MLM) networks.
- Incorporation of these networks into poly-p-phenylene benzobisoxazole (PBO) nanofiber matrices to form a sandwich-structured nanocomposite (S-PBLM/MLM).
- Characterization of electrical insulation, EMI shielding, thermal conductivity, mechanical strength, and stability under harsh conditions.
Main Results:
- The S-PBLM/MLM nanocomposite achieved high electrical insulation (volume resistivity: 1.9 × 10^13 Ω cm, breakdown voltage: 139 kV mm^-1).
- Demonstrated effective EMI shielding (68.2 dB at 25 μm thickness) and excellent in-plane thermal conductivity (50.3 W m^-1 K^-1).
- Exhibited stable performance after exposure to mechanical wear, humidity, ultrasonication, extreme temperatures, thermal shock, and burning, along with high mechanical strength (tensile strength: 252.6 MPa, toughness: 8.8 MJ m^-3).
Conclusions:
- The developed sandwich-structured nanocomposite successfully integrates electrical insulation with EMI shielding and heat dissipation.
- The material shows remarkable stability and mechanical robustness, making it suitable for extreme environments.
- This S-PBLM/MLM nanocomposite holds significant potential for applications in modern electronics, aerospace, and defense industries.
