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Updated: May 15, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
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Soldering and Bonding in Contemporary Electronic Device Packaging.

Yuxuan Li1, Bei Pan1, Zhenting Ge1

  • 1Nanjing Electronic Devices Institute, Nanjing 210000, China.

Materials (Basel, Switzerland)
|May 14, 2025
PubMed
Summary

This paper details electronic packaging soldering and bonding techniques, including wafer, die, and wire bonding. It highlights advanced methods like flip chip and bump bonding for 3D-SiP packages.

Keywords:
die attachmentelectronic packagingflip chip bondingsolderingwafer bondingwire bonding

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Semiconductor Manufacturing

Background:

  • Electronic packaging is crucial for transforming chips into functional devices.
  • Soldering and bonding are fundamental processes in electronic packaging assembly.
  • Evolving packaging architectures necessitate advancements in soldering and bonding technologies.

Purpose of the Study:

  • To provide a comprehensive overview of soldering and bonding techniques in electronic packaging.
  • To detail various wafer bonding, die attachment, and wire bonding methods.
  • To discuss the significance of bump bonding for 3D-SiP packages and emerging trends.

Main Methods:

  • Introduction to direct and indirect wafer bonding technologies.
  • Detailed explanation of five die attachment processes.
  • In-depth description of ball bonding and wedge bonding in wire bonding.
  • Exploration of flip chip bonding and bump fabrication methods.

Main Results:

  • Conventional and advanced soldering/bonding processes are essential in device packaging.
  • Bump bonding, particularly copper bump technology, is a key area in advanced packaging for 3D-SiP.
  • Surface mount and sealing technologies are also relevant in electronic device assembly.

Conclusions:

  • The paper offers valuable insights into contemporary soldering and bonding practices for electronic packaging researchers.
  • Understanding these techniques is vital for the development of advanced electronic devices and systems.
  • Continued research in bonding technologies, especially for 3D integration, is critical for future advancements.