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Microfluidic-Encapsulated Phase Change Fibers with Graphene Coating for Passive Thermal Management
Guanqiu Hao1,2, Le Lyu3, Wei Gao2
1Department of Chemical and Biomolecular Engineering, National University of Singapore, Singapore, 117585, Singapore.
Novel phase change fibers (PCF) with graphene coating offer advanced passive thermal management for electronics. These graphene-coated phase change fibers (GPCF) significantly reduce device temperatures, matching forced air cooling performance with zero energy consumption.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Effective thermal management is crucial for electronic device performance and longevity.
- Current passive cooling methods often struggle with high, intermittent heat loads.
- Phase Change Materials (PCMs) offer potential for thermal energy storage but require robust encapsulation.
Purpose of the Study:
- To develop a novel method for encapsulating phase change materials (PCMs) into flexible fibers.
- To enhance the passive cooling performance of these fibers using graphene coating.
- To evaluate the effectiveness of graphene-coated phase change fibers (GPCF) for electronic thermal management.
Main Methods:
- Microfluidic techniques were employed to create core-shell structured phase change fibers.
- A uniform, non-toxic shell was designed to prevent PCM leakage and allow precise dimensional control.
- Graphene coating was applied to the fiber surface to improve thermal conductivity and emissivity.
Main Results:
- The phase change fibers exhibited a uniform core-shell structure with controlled dimensions and PCM ratios.
- Graphene coating enhanced thermal conductivity and emissivity without compromising structural integrity.
- Experiments showed GPCF effectively reduced peak and average temperatures in electronic components under periodic thermal loads.
- Passive cooling using GPCF matched the performance of forced air cooling (0.8 m/s) with zero energy consumption.
Conclusions:
- Graphene-coated phase change fibers provide a highly effective passive thermal management solution.
- GPCF technology offers significant energy savings potential for electronics with intermittent high heat loads.
- This novel fiber encapsulation method holds promise for advanced, sustainable thermal management in electronics.
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