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Researchers achieved lasing above 2 μm from a single Germanium-Tin (GeSn) nanowire. This breakthrough enables cost-effective, Si-compatible mid-infrared lasers for integrated photonics.

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Area of Science:

  • Materials Science
  • Photonics
  • Nanotechnology

Background:

  • Semiconductor nanowires are key for ultracompact lasers in integrated photonics.
  • Integrating III-V and II-VI nanowire lasers with Si photonics is challenging.
  • Group IV GeSn nanowires offer Si-compatible, cost-effective gain media for mid-infrared lasers.

Purpose of the Study:

  • To demonstrate lasing from a single GeSn nanowire above 2 μm.
  • To overcome integration challenges in Si photonics platforms.
  • To enable all-group IV mid-infrared photonic-integrated circuits.

Main Methods:

  • Experimental observation of lasing from a single bottom-up grown GeSn nanowire.
  • Utilizing strain engineering to enhance material gain.
  • Employing optimized cavity designs to minimize optical losses.

Main Results:

  • Successful demonstration of lasing above 2 μm from a single GeSn nanowire.
  • Achieved amplified material gain exceeding minimized optical losses.
  • Observed single-mode lasing with an ultralow threshold of ~5.3 kW/cm².

Conclusions:

  • This work demonstrates the potential of GeSn nanowires for Si-compatible lasers.
  • The findings pave the way for mid-infrared photonic-integrated circuits.
  • Enables on-chip classical and quantum applications using group IV materials.