Optimizing Perpendicular Magnetic Anisotropy in MgO/CoFeB Structures Through Ultrathin CoFeB-Enhanced Ta Capping
Yu-Shen Yen1,2, Chun-Liang Yang2, Yung-Ling Chang2
1Ph.D. Program in Prospective Functional Materials Industry, National Tsing Hua University, Hsinchu 30013, Taiwan.
ACS Omega
|May 19, 2025
Summary
This study optimizes perpendicular magnetic anisotropy (PMA) in CoFeB/MgO by adding an ultrathin CoFeB layer. This insertion enhances PMA and thermal stability, crucial for advanced spintronic devices.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Perpendicular magnetic anisotropy (PMA) is critical for high-density magnetic storage devices.
- Optimizing the CoFeB/MgO interface is key to enhancing PMA performance and thermal stability.
- Interfacial diffusion and oxidation control are significant challenges in fabricating robust magnetic heterostructures.
Purpose of the Study:
- To investigate the effect of an ultrathin CoFeB insertion layer on PMA in CoFeB/MgO structures.
- To enhance the interfacial magnetic anisotropy and thermal stability of CoFeB/MgO stacks.
- To provide a scalable method for improving PMA compatible with semiconductor manufacturing.
Main Methods:
- Fabrication of CoFeB/MgO stacks with a strategic ultrathin CoFeB insertion layer (0.43 nm) between the CoFeB/MgO and the top capping layer (Ta or Mo).
- Postannealing treatment at 400 °C to optimize interfacial properties.
- Characterization using high-resolution transmission electron microscopy (HR-TEM) and X-ray photoelectron spectroscopy (XPS) to analyze structural and chemical properties.
Main Results:
- The insertion of a 0.43 nm CoFeB layer significantly boosted PMA, achieving an interfacial anisotropy constant (K) of 3.8 erg/cm².
- The CoFeB insertion layer effectively suppressed interfacial diffusion from the Ta or Mo capping layer.
- Improved Fe-O hybridization and stabilized MgO crystallinity were observed, leading to enhanced interfacial integrity.
Conclusions:
- The ultrathin CoFeB insertion layer is a highly effective strategy for enhancing PMA and thermal stability in CoFeB/MgO structures.
- This approach offers a promising solution for next-generation spintronic devices, compatible with CMOS back-end-of-line processing.
- Interfacial engineering through strategic layer insertion is crucial for advancing spintronic technology performance.
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