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Related Concept Videos

Preparation of Samples for Electron Microscopy01:20

Preparation of Samples for Electron Microscopy

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To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...
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Updated: Sep 19, 2025

In Situ Transmission Electron Microscopy with Biasing and Fabrication of Asymmetric Crossbars Based on Mixed-Phased a-VOx
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Self-aligned protective shield for preparing beam-sensitive MEMS-based chip samples using focused ion beam.

Haozhe Lu1, Chuanhong Jin2

  • 1State Key Laboratory for Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, PR China; Jihua Laboratory, Foshan, Guangdong 528200, PR China.

Micron (Oxford, England : 1993)
|June 7, 2025
PubMed
Summary
This summary is machine-generated.

A new self-aligned protective shield method protects beam-sensitive nanostructures during focused ion beam (FIB) preparation for transmission electron microscopy (TEM). This technique prevents ion beam damage, ensuring high-quality specimens for micro-electro-mechanical systems (MEMS) devices.

Keywords:
ContaminantFIBGa(+) damageLow-damage sample preparationMEMS-based chip sample preparation

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electron Microscopy

Background:

  • Focused ion beam (FIB) preparation is crucial for transmission electron microscopy (TEM) but faces challenges with in-situ micro-electro-mechanical systems (MEMS) chip specimen preparation.
  • Transferring samples to MEMS chips often requires stage tilting, leading to ion beam damage, redeposition, and contamination, especially for beam-sensitive materials like aligned single-walled carbon nanotube arrays (A-CNTs).

Purpose of the Study:

  • To develop a novel method for preparing high-quality cross-sectional TEM lamellae for in-situ MEMS-based chips.
  • To mitigate ion beam-induced damage, redeposition, and contamination during the preparation of delicate nanostructures.

Main Methods:

  • A self-aligned protective shield method was developed utilizing the angular offset between electron and ion beams in a dual-beam FIB system.
  • The technique shields the region of interest (ROI) during critical processing steps, compatible with standard sampling methods.

Main Results:

  • The protective shield method effectively prevented ion beam-induced damage, redeposition, and contamination.
  • Experiments on palladium-A-CNT-silicon oxide multilayers demonstrated enhanced interfacial integrity and structural clarity in scanning TEM (STEM) imaging.

Conclusions:

  • The developed method provides a robust and versatile solution for preparing high-quality TEM lamellae for in-situ MEMS chips.
  • This approach is broadly applicable to ion beam-sensitive materials, improving specimen quality for advanced device analysis.