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Automated assembly of hybrid-integrated, chip-scale laser systems
Optics Express
|June 14, 2025
Summary
Automated assembly of hybrid lasers using silicon nitride and gallium arsenide photonic integrated circuits (PICs) reduces coupling losses to 2.7 dB. This process enables scalable production and wider application of advanced hybrid laser systems.
Area of Science:
- Photonics and Materials Science
- Optical Engineering
- Semiconductor Devices
Background:
- Hybrid photonic integration combines materials for novel functionalities.
- Silicon nitride (Si3N4) and gallium arsenide (GaAs) are key materials in photonic integrated circuits (PICs) and gain chips (GCs).
Purpose of the Study:
- To develop and demonstrate an automated alignment and assembly process for hybrid-integrated laser systems.
- To optimize spot size converters (SSCs) for improved alignment tolerances between Si3N4 PICs and GaAs GCs.
Main Methods:
- Edge-coupling of Si3N4 PICs to GaAs GCs.
- Design and optimization of spot size converters (SSCs).
- Automated alignment and assembly protocol implementation.
Main Results:
- Achieved experimental coupling losses of 2.7 dB between PICs and GCs.
- Experimental results closely matched simulated coupling loss values.
- Packaged hybrid lasers demonstrated slope efficiencies of approximately 97 mW/A.
Conclusions:
- The automated assembly process is feasible for scaling production of hybrid laser systems.
- Automation is expected to reduce packaging costs and accelerate research in hybrid photonics.
- Widespread application of hybrid laser systems is facilitated by efficient and cost-effective assembly.
