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Updated: Sep 19, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Joshua Vandervelde1,2, Yeowon Yoon1,2, Rifat Shahriar3
1Center for Advanced Manufacturing University of Southern California Los Angeles CA 90007 USA.
Laser-induced graphene (LIG) offers excellent electrical, heating, and sensing properties for 3D-printed electronics. This study demonstrates low sheet resistance on high-performance polymers like PEI and PEEK, enabling versatile applications.
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