Ag/Fe₃O₄-Catalyzed Fabrication of Flexible Printed Circuits: Integrated UV-Curing and Electroless Plating Process

Area of Science:

• Materials Science and Engineering
• Nanotechnology
• Electrical Engineering

Background:

• Flexible printed circuits (FPCs) are crucial for advanced sensors and actuators.
• Fabricating durable FPCs on heat-sensitive substrates remains a significant challenge.
• Existing methods often require high temperatures, limiting substrate compatibility.

Purpose of the Study:

• To develop an adaptable and efficient method for fabricating high-performance FPCs.
• To enable FPC production on various substrates, including heat-sensitive materials.
• To create a scalable, cost-effective, and sustainable fabrication strategy.

Main Methods:

• Integration of ultraviolet (UV) curing and electroless plating technologies.
• Utilization of a photocurable Ag/Fe3O4 catalyst layer on a thin-film substrate.
• Comprehensive characterization of microstructure, stability, and durability.

Main Results:

• Fabricated FPCs demonstrated superior electrical conductivity and exceptional mechanical durability.
• Minimal resistance variation (<9.0%) observed after 10,000 bending cycles.
• Remarkable thermal stability with resistance change <5.4% from -25 to 65 °C.

Conclusions:

• The developed method offers a scalable, efficient, and repairable fabrication strategy for conductive layers.
• Mild processing conditions eliminate the need for high-temperature sintering equipment.
• Presents a cost-effective and sustainable solution for flexible printed circuit production.