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Updated: Sep 18, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Xiaonan Wang1,2, Yuan Tian1,2, Libing Yao2
1State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou, 310027, China.
A new hole-selective layer (HSL) material, DPAICz, enhances stability and efficiency in silicon/perovskite tandem solar cells. This innovation overcomes challenges in uniform coverage on textured silicon, improving overall device performance and longevity.
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