Ultracompact 3D integrated photonic chip for high-fidelity high-dimensional quantum gates

Kangrui Wang1,2,3, Dawei Lyu1,2,3, Chengkun Cai1,2,3

  • 1Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China.

Science Advances
|July 4, 2025
PubMed
Summary

Researchers developed a compact, polymer-based device using 3D printing for high-dimensional quantum logic gates. This innovation advances quantum information processing on integrated photonic chips.