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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Jeff J P M Schulpen1, Saravana B Basuvalingam1, Marcel A Verheijen1,2
1Department of Applied Physics and Science Education, Eindhoven University of Technology, Eindhoven 5600 MB, the Netherlands. aabol@umich.edu.
Achieving conformal 2D transition metal dichalcogenide (TMD) films on 3D nanostructures requires bending basal planes. A minimum 4 nm radius of curvature is identified for conformal deposition of tungsten disulfide (WS2) films.
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