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Thermal Stress

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...

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Updated: Jun 16, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Simultaneous Thermal Analysis (STA) in a Silicon Microplate.

Yuhang Yang^1,2, Zechun Li^1,2, Ruomeng Guo¹

¹State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China.

Analytical Chemistry

|July 11, 2025

Summary

This study introduces a microelectromechanical system (MEMS) chip for simultaneous thermal analysis (STA), enabling highly sensitive microgram-level mass detection and precise temperature monitoring. This innovation enhances thermal analysis efficiency and safety, particularly for hazardous materials.

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Area of Science:

Materials Science
Analytical Chemistry
Microtechnology

Background:

Simultaneous thermal analysis (STA) is crucial for material characterization, measuring weight and thermal changes.
Existing commercial STA instruments face limitations in sensitivity and application scope.
Microelectromechanical system (MEMS) technology offers potential for miniaturization and enhanced performance.

Purpose of the Study:

To develop a novel MEMS-based monolithic integrated resonant microplate chip for on-chip STA.
To achieve high-sensitivity simultaneous thermogravimetric analysis (TGA) and differential thermal analysis (DTA).
To demonstrate the chip's capabilities in material characterization and hazardous substance analysis.

Main Methods:

Fabrication of a monolithic integrated resonant microplate chip using MEMS technology.
On-chip simultaneous measurement of TGA via resonant microplate frequency changes (0.32 ng resolution).
On-chip simultaneous measurement of DTA using integrated polysilicon thermocouples (2.1 mV/°C sensitivity) and power response (2.3 V/W).

Main Results:

The MEMS chip achieved high-sensitivity mass detection (0.32 ng resolution) and accurate temperature monitoring (2.1 mV/°C).
Experimental verification using metal standards and calcium oxalate monohydrate confirmed improved efficiency and precision.
The microgram-level detection capability allows safe analysis of explosive materials like TNT, mitigating risks associated with larger sample sizes.

Conclusions:

The developed MEMS chip offers a significant advancement in integrated and miniaturized thermal analysis technology.
This innovation provides a new platform for real-time visualization of STA processes.
The technology holds substantial application value for material characterization and hazardous substance measurement.