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Related Concept Videos

MOSFET Amplifiers01:17

MOSFET Amplifiers

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The MOSFET, when operating in its active region, functions as a voltage-controlled current source. In this region, the gate-to-source voltage controls the drain current. This principle underlies the operation of the transconductance MOSFET amplifier. The output current is directed through a load resistor to convert this amplifier into a voltage amplifier. The output voltage is then obtained by subtracting the voltage drop across the load resistance from the supply voltage. This process results...
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Small-Signal Analysis of MOSFET Amplifiers01:23

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In small-signal analysis, a MOSFET transistor amplifier acts as a linear amplifier when operating in its saturation region. The gate-to-source voltage (VGS) of the MOSFET is the sum of the DC biasing voltage and the small time-varying input signal. This combination sets up the operating point and modulates the drain current (ID) that flows from the drain to the source. When a small AC signal is superimposed on the DC bias voltage at the gate, the instantaneous drain current comprises three...
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Low Phase Noise, Dual-Frequency Pierce MEMS Oscillators with Direct Print Additively Manufactured Amplifier Circuits.

Liguan Li1, Di Lan2, Xu Han3

  • 1Department of Electrical Engineering, University of South Florida, 4202 E. Fowler Avenue, Tampa, FL 33620, USA.

Micromachines
|July 30, 2025
PubMed
Summary
This summary is machine-generated.

Three-dimensional (3D) printing enhances microelectromechanical systems (MEMS) oscillators. 3D-printed acrylonitrile butadiene styrene (ABS) substrates improve phase noise and output power compared to traditional printed-circuit-board (PCB) implementations.

Keywords:
MEMSadditive manufacturingadvanced packagingoscillatorphase noisepiezoelectricquality factorresonatorssilicon-on-insulator (SOI)zinc oxide (ZnO)

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Mechanical Engineering

Background:

  • Microelectromechanical systems (MEMS) resonators offer high-quality factors (Q) for stable frequency generation.
  • Traditional printed-circuit-board (PCB) substrates can introduce parasitic effects impacting radio frequency (RF) performance.
  • Three-dimensional (3D) printing offers novel substrate solutions for electronic packaging.

Purpose of the Study:

  • To demonstrate and compare MEMS oscillator performance on conventional PCB and 3D-printed acrylonitrile butadiene styrene (ABS) substrates.
  • To evaluate the impact of 3D-printed chip-carrier packaging on oscillator phase noise and output power.
  • To compare the phase noise characteristics of silicon germanium (SiGe) heterojunction bipolar transistors (HBT) and enhancement-mode pseudomorphic high-electron-mobility transistors (E-pHEMT) in MEMS oscillators.

Main Methods:

  • Fabrication of identical microelectromechanical systems (MEMS) oscillators using piezoelectric zinc oxide (ZnO) resonators on silicon-on-insulator (SOI) wafers.
  • Implementation of oscillators on both conventional printed-circuit-board (PCB) and 3D-printed acrylonitrile butadiene styrene (ABS) substrates.
  • Advanced packaging techniques including precise 3D-printed encapsulation with sub-100 μm lateral interconnects for modular characterization.

Main Results:

  • Oscillators operated simultaneously at dual frequencies (260 MHz and 437 MHz) without additional circuitry.
  • The 3D-printed ABS-based oscillator showed a 2-3 dB improvement in phase noise compared to the PCB-based version.
  • The 3D-printed oscillator achieved higher output power (4.575 dBm at 260 MHz and 0.147 dBm at 437 MHz).
  • Silicon germanium (SiGe) heterojunction bipolar transistors (HBT) demonstrated an 11 dB improvement in phase noise at 1 kHz offset compared to E-pHEMT.

Conclusions:

  • Three-dimensional (3D)-printed chip-carrier packaging significantly enhances MEMS oscillator performance, offering improved phase noise and output power.
  • The lower dielectric loss and reduced parasitic effects of 3D-printed acrylonitrile butadiene styrene (ABS) substrates are key to performance gains.
  • Advanced 3D-printed packaging techniques are viable for high-performance MEMS oscillator applications, ensuring packaging integrity without compromising RF performance.