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    Lens aberrations significantly impact lithographic tool alignment accuracy. This study quantifies aberration effects, providing a foundation for improved error-correction models in semiconductor manufacturing.

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    Area of Science:

    • Optical Engineering
    • Semiconductor Manufacturing
    • Metrology

    Background:

    • Accurate overlay performance in lithographic tools is crucial for semiconductor manufacturing.
    • Lens aberrations are a key factor influencing the precision of alignment systems.
    • Understanding aberration effects is vital for optimizing lithographic processes.

    Purpose of the Study:

    • To investigate the influence of lens aberrations on the alignment accuracy of lithographic tools.
    • To analyze how aberrations affect the sensitivity of misalignment.
    • To develop a foundation for optimizing error-correction models in lithography.

    Main Methods:

    • Simulations using Hyperlith to model optical systems and aberrations.
    • Experimental validation of simulation results through physical measurements.
    • Analysis of the optical system's impulse response function asymmetry.

    Main Results:

    • Lens aberrations cause variations in the sensitivity of odd aberration-induced misalignment.
    • The asymmetry of the impulse response function explains these sensitivity variations.
    • Sensitivity curves were generated and experimentally validated.

    Conclusions:

    • The study refines the understanding of how lens aberrations impact lithographic alignment accuracy.
    • The developed sensitivity curves can be used to optimize error-correction models.
    • Improved alignment accuracy in lithographic processes is achievable through this research.