A synergistically designed strain-insensitive conductive hydrogel with humidity-adaptivity supporting sustained
Zhenyu Li1, Yaping Wang1, Zekun Zhang1
1School of Measurement & Control Technology and Communication Engineering, Harbin University of Science and Technology, Harbin, 150080, China. lizhenyu@hrbust.edu.cn.
Materials Horizons
|August 15, 2025
Summary
This study presents a novel conductive hydrogel using lithium bromide (LiBr) for flexible electronics. The material demonstrates humidity-adaptive water retention and strain-insensitivity, ensuring reliable performance in electronic interconnects.
Area of Science:
- Materials Science
- Polymer Chemistry
- Electronics Engineering
Background:
- Flexible electronics face challenges with hydrogel interconnects due to water evaporation and strain-induced resistance changes.
- Developing stable and reliable conductive hydrogels is crucial for advancing flexible electronic devices.
Purpose of the Study:
- To develop a conductive hydrogel with enhanced stability against water loss and mechanical strain.
- To create a hydrogel with long-term functional maintenance for use as conductive interconnects.
Main Methods:
- Hydrogel polymerization incorporating hygroscopic lithium bromide (LiBr) and acrylamide monomers (Aam).
- Architecting a hierarchical network with dual-dynamic crosslinking and incorporating conductive additives.
- Testing ionic conductivity, stretchability, anti-freezing properties, and gauge factor.
Main Results:
- Achieved hybrid ionic and electronic conductivity of ~0.21 S cm⁻¹.
- Demonstrated an ultralow gauge factor (~0.29) up to 150% strain and low electrical hysteresis (~0.19%).
- Maintained functionality after 10,000 cycles, 6 months of humidity fluctuation, and -56 °C storage.
Conclusions:
- The developed LiBr-integrated conductive hydrogel offers superior humidity-adaptive water retention and strain-insensitivity.
- The material exhibits excellent long-term reliability and is suitable for flexible electronic interconnects.
- This work presents a promising pathway for robust and durable conductive hydrogels in advanced electronics.
