Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives

Tong Su1,2, Chunyu Wong3, Jiashuo Liu1

  • 1Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China. xl.zeng@siat.ac.cn.

Materials Horizons
|August 5, 2026
PubMed