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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives
Tong Su1,2, Chunyu Wong3, Jiashuo Liu1
1Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China. xl.zeng@siat.ac.cn.
Abstract:
Tough adhesives require efficient bulk energy dissipation, yet the molecular design principles for achieving this without sacrificing adhesion strength remain a challenge. Here, we report a chain-length regulation strategy for UV-curable acrylate adhesives, in which long polymer strands between cross-linking points generate effective entanglements, thereby promoting bulk energy dissipation during debonding. The resulting adhesives achieve exceptional adhesion strength (23.13 MPa) and ultrahigh adhesion toughness (36.77 kJ m-2). Fracture measurements and digital image correlation show that the long-chain entangled network markedly increases bulk fracture energy by delocalizing crack-tip strain into an enlarged deformation process zone and retarding crack propagation. Chain-dynamics and chain-conformation analyses further confirm the role of entanglement by revealing a broader relaxation spectrum and a much larger releasable conformational length in the long-chain network that enhances bulk energy dissipation. We further demonstrate its application potential and excellent long-term environmental stability, together with a physics-informed prediction of long-term adhesion retention across practical service temperatures. These results establish chain-length regulation as an effective molecular design strategy for strong and tough adhesives.

