Yield-Stress Composite Fluids With High Thermal Conductivity and Tunable Rheology via Hierarchical Filler

Shujun Cai1,2, Jianfeng Fan1, Jiahui Wang1

  • 1State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.

Summary

This study introduces a novel yield-stress fluid with a hierarchical filler structure for advanced thermal management. The material exhibits tunable properties, combining low viscosity, controllable yield stress, and high thermal conductivity for efficient heat dissipation.

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