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Yield-Stress Composite Fluids With High Thermal Conductivity and Tunable Rheology via Hierarchical Filler
Shujun Cai1,2, Jianfeng Fan1, Jiahui Wang1
1State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
This study introduces a novel yield-stress fluid with a hierarchical filler structure for advanced thermal management. The material exhibits tunable properties, combining low viscosity, controllable yield stress, and high thermal conductivity for efficient heat dissipation.
Area of Science:
- Materials Science
- Rheology
- Thermal Engineering
Background:
- Yield-stress fluids offer tunable mechanical properties, transitioning between solid and liquid states.
- Conventional yield-stress fluids face a trade-off between viscosity and thermal conductivity, limiting thermal management applications.
Purpose of the Study:
- To develop a yield-stress fluid with enhanced thermal conductivity and controllable rheological properties for thermal management.
- To overcome the limitations of traditional materials in balancing viscosity, yield stress, and thermal performance.
Main Methods:
- Incorporation of multi-sized aluminum nitride particles into a polydimethylsiloxane (PDMS) matrix to create a hierarchical filler architecture.
- Rheological characterization to assess viscosity, yield stress, and thixotropic recovery.
- Physics-informed neural network (PINN) modeling for performance analysis.
Main Results:
- Achieved a yield-stress composite fluid with low viscosity (731.3 Pa·s at 10 s⁻¹), tunable yield stress (37.3–802.3 Pa), and high thermal conductivity (12.0 W·m⁻¹·K⁻¹).
- Demonstrated excellent thixotropic recovery and mechanical robustness.
- The material's dual liquid-like and solid-like states enable efficient distribution and long-term reliability as a thermal interface material.
Conclusions:
- The hierarchical filler architecture strategy successfully creates advanced yield-stress fluids with desirable rheological and thermal properties.
- This approach offers a new pathway for designing high-performance thermal interface materials for demanding applications.
- The developed fluid shows significant potential for improving thermal management systems.
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