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In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron

Kazuhiro Nogita1, Xin Fu Tan1, Jiye Zhou1

  • 1Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.

Materials (Basel, Switzerland)
|August 28, 2025
PubMed
Abstract

Keywords:
Pb-free solderelectronics packaginghigh-voltage transmission electron microscopyin situ deformation

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