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Process Optimization on Trepanning Drilling in Titanium Alloy Using a Picosecond Laser via an Orthogonal Experiment
Liang Wang1, Yefei Rong1, Long Xu1
1Faculty of Mechanical and Materials Engineering, Huaiyin Institute of Technology, Huai'an 223003, China.
Micromachines
|August 28, 2025
Summary
This study optimized picosecond laser trepan drilling for titanium alloy TC4. Optimal parameters were identified to improve micro-hole quality, reducing processing time.
Area of Science:
- Materials Science and Engineering
- Manufacturing Processes
- Laser Machining
Background:
- Titanium alloys like TC4 are crucial in aerospace and medical industries.
- Efficient and precise micro-hole drilling is essential for manufacturing components from these alloys.
- Existing laser drilling methods require optimization for speed and quality.
Purpose of the Study:
- To optimize the picosecond laser trepan drilling process for titanium alloy TC4.
- To analyze the influence of key laser parameters on micro-hole quality (diameter, taper, roundness).
- To reduce overall processing time for micro-hole fabrication.
Main Methods:
- Utilized picosecond laser trepan drilling on TC4 titanium alloy.
- Employed an L25 (5^6) orthogonal array for experimental design.
- Investigated the effects of laser power, defocusing distance, scanning speed, and number of scans.
- Applied mean response and range analyses for parameter impact evaluation.
Main Results:
- Scanning speed and laser power significantly impact micro-hole diameters.
- Defocusing distance is critical for controlling micro-hole taper.
- Laser power and defocusing distance influence roundness, with laser power being key for inlet roundness.
- Number of scans showed a weaker correlation with hole quality metrics.
Conclusions:
- Identified optimal parameters for picosecond laser trepan drilling of TC4: 90% laser power (30 W), -0.2 mm defocus, 27 mm/s scanning speed, and 15 scans.
- The optimized process enhances micro-hole quality (diameter, taper, roundness).
- Achieved significant reduction in processing time through parameter optimization.

