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Radiative Coupled Evaporation Cooling Hydrogel for Above-Ambient Heat Dissipation and Flame Retardancy
Qin Ye1, Yimou Huang1, Baojian Yao1
1School of Energy Science and Engineering, Central South University, Changsha, 430001, People's Republic of China.
Nano-Micro Letters
|September 1, 2025
Summary
This study presents a novel photonic hydrogel for radiative coupled evaporative cooling (REC). The new material enhances heat dissipation and flame retardancy in outdoor devices, offering improved thermal management.
Area of Science:
- Materials Science
- Thermal Engineering
- Nanotechnology
Background:
- Radiative cooling (RC) and evaporative cooling (EC) are effective for sub-ambient cooling.
- Outdoor devices face challenges with interior heating, increasing temperature and fire risk.
- Existing RC films have limited cooling power and fire safety concerns.
Purpose of the Study:
- To develop an all-in-one photonic hydrogel for radiative coupled evaporative cooling (REC).
- To enhance above-ambient heat dissipation and flame retardancy for outdoor devices.
- To improve passive water cycle properties for efficient cooling.
Main Methods:
- Integration of radiative cooling and evaporative cooling principles into a single photonic hydrogel.
- Design of a hydrogel capable of both heat dissipation and flame retardancy.
- Experimental validation of the hydrogel's performance in outdoor conditions.
Main Results:
- The REC hydrogel demonstrated significantly improved heat dissipation compared to conventional RC films, achieving 12.0 °C lower temperatures outdoors.
- Nighttime radiative cooling-assisted adsorption enhanced atmospheric water harvesting for daytime evaporative cooling.
- The hydrogel exhibited enhanced flame retardancy by absorbing heat without temperature increase, mitigating fire risks.
Conclusions:
- The developed REC photonic hydrogel offers a promising solution for thermal management in outdoor devices.
- The material provides superior heat dissipation and robust flame retardancy.
- This integrated approach addresses key limitations of existing cooling technologies for demanding applications.
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