FEA-based optimal design of special suction cups temperature-controlled coatings

To address the growing demand for temperature control precision and uniformity in wafer processing, a specialized electrostatic chuck temperature control system based on thermal control coatings is proposed, aiming to enhance thermal management robustness and homogeneity. This study employs a zoned control methodology using metal-oxide conductive coatings on silicon carbide wafer heating plates. A quadrant-based thermal control coating model was established, and finite element analysis was conducted to compare temperature distribution characteristics across three geometric configurations: sectorial, spiral, and zoned designs. The zoned structure was identified as the optimal configuration. The heating mechanism and heat transfer principles of the specialized chuck were analyzed, encompassing thermal conduction, convection, and radiation, with key factors influencing temperature distribution elucidated. Finite element simulation was utilized to optimize the thermal control system design, incorporating structured meshing to ensure computational accuracy. Experimental results demonstrate that precise regulation of coating current variations achieves maximum temperature difference control below 0.2°C and surface temperature uniformity stabilized at approximately 0.05°C, validating the efficacy of the methodology. These findings establish a robust theoretical foundation for further optimization of temperature control systems in semiconductor thermal management applications.