FEA-based optimal design of special suction cups temperature-controlled coatings

Area of Science:

• Materials Science
• Semiconductor Manufacturing
• Thermal Engineering

Background:

• Growing demand for precise temperature control in wafer processing.
• Need for enhanced thermal management robustness and homogeneity in semiconductor fabrication.

Purpose of the Study:

• Propose a specialized electrostatic chuck temperature control system using thermal control coatings.
• Optimize thermal management for improved temperature precision and uniformity.

Main Methods:

• Employed a zoned control methodology with metal-oxide conductive coatings on silicon carbide heating plates.
• Established a quadrant-based thermal control coating model.
• Utilized finite element analysis (FEA) for geometric configuration comparison and system optimization.

Main Results:

• Identified the zoned structure as the optimal configuration among sectorial, spiral, and zoned designs.
• Achieved maximum temperature difference control below 0.2°C.
• Stabilized surface temperature uniformity at approximately 0.05°C through precise coating current regulation.

Conclusions:

• The proposed electrostatic chuck system effectively enhances thermal management robustness and homogeneity.
• Demonstrated the efficacy of the zoned control methodology for high-precision temperature regulation.
• Established a theoretical foundation for advanced semiconductor thermal management systems.