Growth Behavior of Multi-Element Compound Layers During Reactive Diffusion Between Solid CoCrFeMnNi Alloy and Liquid...

In the present study, the diffusion couple of solid CoCrFeMnNi HEA and liquid pure Al was prepared. The microstructure evolution and relevant interdiffusion behavior of CoCrFeMnNi HEA/Al solid-liquid diffusion couple processed by different parameters were characterized and investigated. Results demonstrated that the interfacial compounds in the order of Al(Co, Cr, Fe, Mn, Ni), Al₁₃(Co, Cr, Fe, Mn, Ni)₄ and Al₄(Co, Cr, Fe, Mn, Ni) were determined in the interdiffusion area along the direction from CoCrFeMnNi HEA to Al, and the precipitated Al₄(Cr, Mn) and Al₉(Co, Fe, Ni) phases were formed in the center of Al couple. In addition, the diffusion mechanism and activation energy of growth for each diffusion layer were revealed and determined. More importantly, the growth mechanism of each diffusion layer was also investigated and uncovered in detail. Meanwhile, the activation energy of each intermetallic layer was obtained by the Arrhenius equation and the linear regression method. It is anticipated that this present study would provide a fundamental understanding and theoretical basis for the high-entropy alloy CoCrFeMnNi HEA, potentially applied as the cast mold material for cast aluminum alloy.