Development and properties of an emulsion-based adhesive with electromagnetic shielding performance and high bonding...

Wood adhesives that combine high bonding strength with electromagnetic interference shielding capabilities have attracted widespread attention. Inspired by the organic-inorganic hybrid structures found in organisms such as oysters, this study designed and constructed a nanophase-reinforced organic-inorganic hybrid cross-linked network. The system, based on the synergistic interaction of carboxylated styrene-butadiene latex adhesive, sodium alginate (SA), and carbon nanotubes (CNTs), significantly enhanced the bonding strength of the adhesive and endowed it with electromagnetic interference (EMI) shielding performance. SA was incorporated into the XSBL matrix, and tetraethylenepentamine was used to induce amide cross-linking, forming a stable covalently cross-linked network. Meanwhile, the physical incorporation of CNTs formed conductive pathways within the matrix, thereby improving the electrical conductivity and EMI shielding effectiveness of the material. When the CNTs content reached 15 wt%, the resulting adhesive exhibited a dry bonding strength of 4.48 MPa, an increase of 348 % compared to the original XSBL, and achieved a high electrical conductivity of 15.18 S/m. The corresponding three-layer plywood demonstrated an EMI shielding effectiveness of up to 32 dB. This study provides a feasible adhesive design strategy for high-performance, multifunctional wood-based plywood intended for use in electronic environments, offering new insights into the development of functional wood materials.