Two-Dimensional Covalent Organic Framework Films for High Dielectric Strength Electrically and Thermo-Mechanically
Maninderjeet Singh1,2, Rajpiraveen Parthiban3, Erin M Schroeder4
1Department of Chemical and Biomolecular Engineering, University of Houston, Houston, Texas 77204, United States.
ACS Nano
|October 14, 2025
Summary
Advanced dielectric materials are crucial for faster microprocessors. Two-dimensional covalent organic framework (COF) films offer ultra-low permittivity and high dielectric strength, meeting next-generation electronic device needs.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Miniaturized microprocessors face performance limitations due to conventional dielectric materials.
- Existing low-permittivity (low-κ) materials exhibit inadequate dielectric strength and thermo-mechanical stability.
- Next-generation electronics, including AI, require advanced dielectric materials with κ < 1.6.
Purpose of the Study:
- To develop novel dielectric films with ultra-low permittivity and superior dielectric strength.
- To investigate the potential of two-dimensional (2D) covalent organic frameworks (COFs) for advanced electronic applications.
- To overcome the limitations of current low-κ materials in high-performance microelectronics.
Main Methods:
- Synthesis of 2D COF films utilizing a liquid-liquid interfacial reaction.
- Characterization of dielectric properties, including permittivity (κ) and dielectric strength.
- Evaluation of thermo-mechanical properties such as density and Young's modulus.
Main Results:
- Achieved ultra-low permittivity (κ ≈ 1.17 at 100 kHz).
- Demonstrated ultrahigh dielectric strength (≈ 3908 MV/m at room temperature).
- Reported low density (≈1.1 g/cm³) and high Young's modulus (≈3.4 GPa).
Conclusions:
- 2D COF films exhibit exceptional dielectric properties surpassing next-generation electronic device requirements.
- The highly crystalline and periodic nanoporous structure of 2D COFs enables their superior performance.
- These findings present a promising solution for advanced microprocessors and AI hardware.
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