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Design of Residual Stress-Balanced Transferable Encapsulation Platform Using Urethane-Based Polymer Superstrate for

Sung-Hun Jo¹, Donghwan Kim², Chaewon Park²

¹Division of System Semiconductor, Dongguk University, Seoul 04620, Republic of Korea.

|October 16, 2025

Summary

A novel stress-balanced encapsulation platform enhances barrier performance for ultrathin wearable electronics. This technology improves moisture resistance and device reliability for advanced skin-mounted applications.

Keywords:

ALD nano-stratified barrier OLED reliability iCVD polymer superstrate residual stress balancing transferable encapsulation

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Area of Science:

Materials Science
Polymer Science
Nanotechnology

Background:

Wearable electronics require robust encapsulation for barrier properties and mechanical reliability.
Ultrathin, transferable encapsulation is crucial for skin-mounted devices.

Purpose of the Study:

Develop a residual stress-balanced encapsulation platform for wearable electronics.
Improve barrier performance and mechanical stability of ultrathin encapsulation.

Main Methods:

Fabrication of a urethane-based copolymer superstrate [p(IEM-co-HEMA)] using initiated chemical vapor deposition (iCVD).
Integration of an ALD Al2O3/ZnO nano-stratified barrier with an SiO2 capping layer.
Characterization of moisture vapor transmission rate (WVTR) and device performance (OLEDs).

Main Results:

The stress-balanced design doubled the critical thickness of the barrier to 60 nm.
Achieved a significant reduction in WVTR to 3.75 × 10^-5 g/m^2/day.
OLEDs maintained performance and stability after transfer and on-skin deformation.

Conclusions:

The developed encapsulation platform offers a practical solution for durable wearable optoelectronics.
The stress-balancing strategy is key to achieving high barrier performance in ultrathin films.
This work paves the way for next-generation, reliable skin-mounted electronic devices.