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Production-Ready Double-Sided Fabrication of Dual-Band Infrared Metaoptics Using Deep-Ultraviolet Lithography.

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  • 1Physics and Astronomy, Faculty of Engineering and Physical Sciences, University of Southampton, Southampton SO17 1BJ, United Kingdom.

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Summary

We developed a production-ready method for fabricating double-sided metasurfaces using deep-UV lithography. This breakthrough enables high-quality metaoptics, paving the way for scalable infrared applications.

Keywords:
LWIRMWIRdeep-UV lithographymetalensmetaopticsmultibandthermal imaging

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Area of Science:

  • Optics and Photonics
  • Materials Science
  • Semiconductor Manufacturing

Background:

  • Metaoptics leverage metasurfaces for advanced optical functions, offering size, weight, and cost advantages over traditional optics.
  • Scalable semiconductor fabrication processes are crucial for transitioning metaoptics from research to real-world applications.

Purpose of the Study:

  • To introduce a production-ready method for fabricating high-quality, double-sided metasurfaces.
  • To demonstrate the capabilities of this method for creating advanced metaoptic devices.

Main Methods:

  • Utilized deep-UV lithography for simultaneous patterning of both sides of a silicon wafer with precise alignment.
  • Employed multireticle stitching to fabricate large-area (40 mm diameter) metalenses.

Main Results:

  • Achieved precise mutual alignment of approximately 10 μm between front and back side patterns without through-wafer markers.
  • Demonstrated a dual-band metalens with independent focal length control in mid- and long-wavelength infrared bands.
  • Showcased excellent broadband imaging performance with partial chromatic dispersion cancellation in a hybrid configuration.

Conclusions:

  • Established a production-ready approach for infrared metaoptics and double-sided metasurface fabrication.
  • The developed method has direct potential for scalable technology translation in real-world applications.